Several items are needed for this experiment, which include:

• A piece of semiconductor wafer. In the present case, we are using a p-type doped Ge wafer, but other samples that you may have access to will work.
• You may need a caliper to measure the semiconductor sample thickness. In our case, the sample wafer is 500 microns thick as measured by the vendor.
• Diamond scribe to assist in cleaving the semiconductor sample.
• Cotton swabs and acetone to clean the semiconductor surface.
• Silver paste and thin gauge wire.
• Kapton tape and apiezon N grease.
• Tweezers, toothpick (for spreading N grease).
• Latex or nitrile gloves for sample handling.
• ETO transport puck.
• Puck wiring test station and ohm meter (to test continuity of silver paste joints).